New pressure sensor technology unveiled

STMicroelectronics, a global semiconductor and micro-electro-mechanical systems (MEMS) manufacturer, has announced a new, patented technology that isolates the pressure-sensing element within a fully moulded package to meet the ultra-small form factor requirements and design creativity for the next generation of portable consumer devices.

The company claims, by integrating the isolated pressure-sensing element in a fully moulded package, that its technology enables fully encapsulated wire bonding with zero risk of corrosion, elimination of wire bonding damage during pick and place assembly, among other benefits.

‘This technology represents a revolution in the enhancement of performance and quality for pressure sensors. We’ve pioneered the use of fully moulded packages without gel for high volume manufacturing for accelerometers and gyroscopes,’ says Benedetto Vigna, executive VP at STMicroelectronics.

The new technology enhances accuracy (+/- 0.2 mbar) while continuing to offer zero drift, low noise (0.010 mbar RMS) and a simplified calibration system.